Assessing the quality of x-ray optic surfaces of Si crystals cut by diamond-wire and rotating-blade sawing techniques.
- X-Ray Science Division
The next generation of X-ray diffraction optics will benefit from crystal surfaces with very high quality (extremely flat and strain-free), but knowledge on how to achieve such surfaces and how surface imperfections affect the diffraction properties is sparse in the literature. As a first step to initialize a systematic study on this topic, we evaluate in this paper the surface quality of two Si (111) wafers cut by a diamond-wire saw and a rotating blade saw, respectively. We concentrate on revealing lattice strains induced by the two cutting methods and on strain evolution during three rounds of chemical etching (without polishing). The measurements also provide some important clues as to how surface roughness affects rocking curve widths and other diffraction properties.
- Research Organization:
- Argonne National Lab. (ANL), Argonne, IL (United States)
- Sponsoring Organization:
- USDOE Office of Science (SC)
- DOE Contract Number:
- DE-AC02-06CH11357
- OSTI ID:
- 1014797
- Report Number(s):
- ANL/XSD/CP-61855; TRN: US201113%%33
- Resource Relation:
- Conference: 2008 Denver X-ray Conference (DXC2008); Aug. 4, 2008 - Aug. 8, 2008; Denver, CO
- Country of Publication:
- United States
- Language:
- ENGLISH
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