Stress relaxation of braze joints
Calculations of residual stresses in braze joints are required to validate designs for a variety of metal/ceramic joining applications. In particular, finite element analysis (FEA) codes have the capability of incorporating either elastic-plastic or minimum creep rate constitutive models for the braze material. This paper presents both elevated temperature mechanical properties correlations for the eutectic Ag-Cu alloy, along with FEA results which use this data in calculating residual stresses in a generic metal/ceramic ``shear`` type braze joint. Three constitutive relations have been developed for eutectic Ag-Cu alloy: (1) an elastic/plastic correlation incorporating temperature-dependent yield stress and work hardening data, (2) a high temperature minimum creep rate correlation with a temperature-dependent stress exponent and (3) a minimum creep rate correlation using the Garofalo hyperbolic sine (sinh) equation. FEA calculations are presented for a eutectic Ag-Cu braze joint between metallized alumina ceramic and either Fe-29Ni-17Co or Fe-27Ni-25Co alloys using the three different constitutive relations for the brazement. The two creep correlations, since they are time-dependent, permit a study of the effect of various cooldown cycles on the maximum residual stress in the alumina ceramic. For the cooldown profiles studied in this paper, lower residual stresses are predicted in the ceramic -- relative to the elastic-plastic model -- when either of the two creep models are used as the constitutive law for the eutectic Ag-Cu braze joint. A second important result is that the simulations which incorporate the Fe-29Ni-17Co alloy show higher peak stresses than the Fe-27Ni-25Co alloy at 420{degree}C, along with much lower peak stresses compared to Fe-27Ni-25Co alloy at room temperature. The reason for this somewhat surprising behavior can be understood in terms of the coefficient of thermal expansion for the two Fe-Ni-Co alloys. 20 refs.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-76DP00789
- OSTI ID:
- 10123873
- Report Number(s):
- SAND-92-0190C; CONF-920452-3; ON: DE92007989
- Resource Relation:
- Conference: American Society of Mechanical Engineers/Japan Society of Mechanical Engineers (ASME/JSME) joint conference on electronic packaging,San Jose, CA (United States),9-12 Apr 1992; Other Information: PBD: [1991]
- Country of Publication:
- United States
- Language:
- English
Similar Records
High temperature creep properties of eutectic and near eutectic silver-copper alloys: Application to metal/ceramic joining
Residual stresses in metal/ceramic brazes: Effect of creep on finite element analysis results