Solder extrusion pressure bonding process and bonded products produced thereby
Patent Application
·
OSTI ID:10104435
Production of soldiered joints which are highly reliable and capable of surviving 10,000 thermal cycles between about {minus}40{degrees}C and 110{degrees}C. Process involves interposing a thin layer of a metal solder composition between the metal surfaces of members to be bonded and applying heat and up to about 1000 psi compression pressure to the superposed members, in the presence of a reducing atmosphere, to extrude the major amount of the solder composition, contaminants including fluxing gases and air, from between the members being bonded, to form a very thin, strong intermetallic bonding layer having a thermal expansion tolerant with that of the bonded members.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-76DP00789
- Assignee:
- Dept. of Energy
- Patent Number(s):
- PATENTS-US-A7511684
- Application Number:
- ON: DE92004603; PAN: 7-511,684
- OSTI ID:
- 10104435
- Resource Relation:
- Other Information: PBD: 1990
- Country of Publication:
- United States
- Language:
- English
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Solder extrusion pressure bonding process and bonded products produced thereby
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